Dev./Trends LS-DYNA
In the course of this info event, new developments in LS-DYNA will be presented, and their application will be explained. The objectives are to inform users of LS-DYNA of new possibilities and to give interested persons who already have experience with other explicit FE solvers an overview of the performance features of LS-DYNA.
Releases of new versions will be discussed. Changes affecting the user and new possibilities provided in the application will be explained in detail. Moreover, planned future developments and trends will be presented with appropriate background information. The focal points of this event will be adapted to current developments.
Content:
- New keywords in general
- Hardware performance with LS-DYNA (Scaling, MPI, Hybrid MPP/SMP, GPUs,...)
- Joining technique, spot weld / bond failure
- Material modeling: plastics, composites, high strength steels
- New element formulations
- Further developments in LS-DYNA/implicit
- Special areas: ALE, CPM, EFG, SPH, CFD,...
- News in LS-PrePost
- DYNAtools: data compression (plotcprs), model check (check-c, check-hsp, check-failed ...), conversion of output files (plot2nodout, nodrel, plot2bc)
| Dates | Registration | Calendar | Duration/days | Location | Lecturer | Fee | Language |
| 11.06.2012 | Register |
|
1/2 | Stuttgart |
|
free | german |
