LS-DYNA Compact: Introduction to Welding Simulation (2 Parts)

Recent developments in LS-DYNA target to close the virtual process chain
with respect to the thermal-mechanical coupled process steps such as line
welding and resistance spot weld. In this webinar most of these developments
are discussed. New boundary conditions and contact algorithms for the thermal
and the structure solver of LS-DYNA are introduced that provide a flexible and
comfortable framework to set up welding simulations. Furthermore, the webinars
covers coupling approaches for the transfer of temperature fields to a structure
simulation and also tailored material models for the process.

Content:
1)  Simulating the temperature field during welding
- Brief introduction to the thermal solver in LS-DYNA
- Thermal material models tailored for welding  applications
- Thermal boundary conditions for weld source modeling
- Modeling heat conductance between the parts in the welding process

2) Thermal-mechanical coupled welding simulations
- Introduction of coupling approaches between thermal and structure solver in LS-DYNA
- Structure material models tailored for welding applications, possibly including evolution of the microstructure
- Welding contact

 

Dates:

Day 1: 29 June, 3-5 pm
Day 2: 30 June, 3-5 pm

 

Please register separately for each part.

Dates
Dates Duration/days Registration Referee Language Location Fee
29.06.2020
2 days
Thomas Klöppel
400 €

Lecturers

Thomas Klöppel
Thomas Klöppel

Dr.-Ing.
Areas of expertise: Composites, welding processes, thermal forming processes
Academic studies: Mathematics

Contact
contact Maik Schenke
  • Training Courses
  • Multiphysics
contact Carina Sieber
  • Seminar Organization
  • Marketing
  • Order Processing
0